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Factors Affecting Interconnects in Space
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"Factors Affecting Interconnects in Space"

Mechanical, electrical, and optical requirements for interconnects in launch vehicles and Low-Earth-Orbit (LEO) satellites.

Electronic and electrical components and their interconnects undergo extreme stress during the launch and orbit insertion of low-Earth-orbit (LEO) satellites. On LEO missions, interconnects must meet demanding requirements for vibration, electrostatic discharge, outgassing, temperature (from -270°C to 200°C), size-weight-and-power (SWAP)—and more.

What You'll Learn:

The paper examines critical factors that influence the cost and performance of interconnects in space.

  • Minimizing size and weight
  • Withstanding vibration, acoustic loads, and shock
  • Withstanding temperature extremes
  • Minimizing outgassing
  • Controlling electrostatic discharge (ESD)
  • Reducing electromagnetic permeability
  • Controlling corrosion

How TE can help

We extend our track record of developing interconnects for space that began with Surveyor lunar landers in the 1960’s to advancing space-qualified Space VPX, VITA, NASA, ESA, and MIL-SPEC compliant products today. We can help designers meet mission objectives for launch vehicles, LEO satellites, and constellations employed in today’s new space economy.


Offered Free by: TE Connectivity
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